| 摘要 |
PROBLEM TO BE SOLVED: To prevent the members, which are provided for various equipment used in the semiconductor process, particularly in the dry process, and for attachments therefor, from being corroded by environmental components and being damaged by plasma erosion. SOLUTION: A B4C film of 0.5-10% porosity and 100-1000μm film thickness is formed on the surface of a base material made of metal or carbon by, e.g. thermal spraying in nonoxidizing atmosphere, or a B4C thermally sprayed film is applied after a metallic layer is formed as an undercoat. By this method, the members excellent in damage characteristic to plasma erosion resistance as well as in chemical corrosion resistance can be obtained.
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