| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preparing epoxy adhesion films having film formability which are excellent in properties such as handleability, copper foil peeling strength, rigidity, electrolytic corrosion resistance, and low coefficient of thermal expansion. SOLUTION: This method for preparing an epoxy adhesion film comprises dissolving a thermosetting epoxy composition comprising, as the major components, a high molecular weight epoxy polymer having a weight average molecular weight, in terms of styrene by the gel permeation chromatography, of not less than 50,000 which is obtained by heating a difunctional epoxy resin and a difunctional phenol in the presence of a catalyst in a solvent to effect polymerization, a polyfunctional epoxy resin, a curing agent and a crosslinking agent in a solvent to form a varnish, compounding the varnish with a non- fibrous inorganic filler having an average particle diameter of 0.8-5.0μm, coating the resulting product on one surface or both surfaces of a substrate and removing the solvent.
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