| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-resistant resin composition having a high glass transition temperature, excellent in heat resistance, having a relatively low elastic modulus, excellent in crack resistance, and useful for forming the insulating layers of multi-layered printed circuit boards by dispersing a specific filler in a specified matrix resin component. SOLUTION: This heat-resistant resin composition is obtained by dispersing (B) 5-50 pts.wt. of a polyurethane-based filler having urethane structures in at least a part of the unit structures and having an elastic modulus of <=30 kgf/mm2 to (A) 100 pts.wt. of a matrix resin component having fluorene skeletons in at least a part of the unit structures. The matrix resin having fluorene skeletons is preferably an alkali-soluble resin obtained by reacting an acid anhydride with a fluorene epoxy (meth)acrylate derived from a bisphenol compound of the formula (R1, R2 are each H, a 1-5C alkyl or the like).
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