发明名称 Method for fabricating a capacitor of a semiconductor device
摘要 A method for fabricating a capacitor of a semiconductor device which stabilizes the operation of electrodes of the capacitor and improves the operational characteristic and reliability of the semiconductor device. The method comprises the steps of: preparing a semiconductor substrate; forming an insulating layer on the substrate; forming a contact hole by selectively eliminating the lower insulating layer; forming a plug in the contact hole; forming a Ti/TiN film thereon; forming a first ruthenium oxide film on the Ti/TiN film, forming a first SOG film on the first ruthenium oxide film; implanting impurities into a surface of the first SOG film; forming a second SOG film on the first SOG film, and then selectively eliminating the first and the second SOG films; etching the first ruthenium oxide film and the Ti/TiN film by utilizing the first and second SOG films as a mask; eliminating the first and second SOG films, and then forming a dielectric film on the exposed surface thereof; and forming a second ruthenium oxide film on the dielectric film.
申请公布号 US6080594(A) 申请公布日期 2000.06.27
申请号 US19990336698 申请日期 1999.06.21
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 CHOI, KYEONG KEUN
分类号 H01L27/04;H01L21/02;H01L21/3213;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01G7/06 主分类号 H01L27/04
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