| 摘要 |
PURPOSE: A heat sink for a flipped chip device and a method for connecting the heat sink are provided to decrease a thermal resistance by dissipating heat efficiently. CONSTITUTION: A heat sink for a flipped chip device includes a substrate with a plurality of terminal pads(121), an integrated circuit device, a heat sink plate, and a plurality of electrical interconnections(134). The integrated circuit device includes first and second surfaces. The heat sink plate includes a plurality of legs(141). The first plane(125) includes a plurality of electrical interconnections(134) on the terminal pads(121). The second surface(126) is coupled to the heat sink plate) by way of a first thermal connection material(142), each of the plurality of legs(141) are coupled to the substrate by way of a second thermal connection material(143). |
