| 摘要 |
PURPOSE: A monomer, its polymer, a negative photosensitive corrosion-resistant layer composition and a method for forming patterns are provided, to obtain the negative photosensitive corrosion-resistant layer which is desirable for the photo lithography using the light with the wavelength below 220 nm as an exposing light and has dry etching-resistance, high resolution and high adhesive strength to the board, and whose pattern does not modified by swelling. CONSTITUTION: The monomer is represented by the formula 1, and the polymer contains the repeating unit represented by the formula 6. In the formulas 1 and 6, R¬1 is a hydrogen atom or a methyl group, R¬2 is an alkylene group of C2-C6, and X is an aliphatic alkyl group containing diols. The negative photosensitive corrosion-resistant layer composition comprises 50-98 parts by weight of the previously mentioned polymer; 1-50 parts by weight of a cross-linking agent containing the functional group represented by the formula 12; 0.2-15 parts by weight of a photo-acid generating agent which generates acids by exposure; and optionally polyalcohols. In the formula 12, R14 is a hydrogen atom, an alkyl group of C1-C6, or an oxoalkyl group of C3-C6. The pattern of a corrosion-resistant layer is formed by coating the composition on the board; exposing the composition to the light with the wavelength 180-220 nm; baking it; and developing it.
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