| 摘要 |
PURPOSE: A semiconductor device is provided which is particularly a semiconductor device of an area pad type. CONSTITUTION: An interconnection or active element (3) is formed on a substrate (1), and an electrode pad (5) is formed on the interconnection or active element (3) with an interlayer insulating film (4) therebetween. A projected electrode (7) is formed on the surface of the electrode pad (5) for protecting the interconnection or active element (3) during bonding to an external terminal. |
