发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE: A device is provided for a highly reliable power semiconductor module to be realized at a low cost. CONSTITUTION: A semiconductor device is provided with a metal substrate, a plurality of wires fixed to the substrate through an insulating layer, and power circuit section electrically connected to the wires. The power circuit section is provided with a plurality of circuit parts which are electrically connected to the wires and respectively united, and a plurality of terminals which are bonded to the wires.
申请公布号 KR20000035836(A) 申请公布日期 2000.06.26
申请号 KR19997001512 申请日期 1999.02.25
申请人 HITACHI LTD. 发明人 TANBA, AKIHIRO;YAMADA, KAZUJI;OGAWA, TOSHIO;SAITO, RYUICHI;SHIGEMURA, TATSUYA
分类号 H01L25/04;(IPC1-7):H01L25/04 主分类号 H01L25/04
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