发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A device is provided for a highly reliable power semiconductor module to be realized at a low cost. CONSTITUTION: A semiconductor device is provided with a metal substrate, a plurality of wires fixed to the substrate through an insulating layer, and power circuit section electrically connected to the wires. The power circuit section is provided with a plurality of circuit parts which are electrically connected to the wires and respectively united, and a plurality of terminals which are bonded to the wires. |
申请公布号 |
KR20000035836(A) |
申请公布日期 |
2000.06.26 |
申请号 |
KR19997001512 |
申请日期 |
1999.02.25 |
申请人 |
HITACHI LTD. |
发明人 |
TANBA, AKIHIRO;YAMADA, KAZUJI;OGAWA, TOSHIO;SAITO, RYUICHI;SHIGEMURA, TATSUYA |
分类号 |
H01L25/04;(IPC1-7):H01L25/04 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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