SEMICONDUCTOR DEVICE WITH A CONNECTION TERMINAL OF GRID ARRAY TYPE

摘要

PURPOSE: A semiconductor device with a connection terminal of grid array type is provided to couple bump electrodes of the semiconductor device to an implementation board securely. CONSTITUTION: A semiconductor device with a connection terminal of grid array type includes a semiconductor device(1), and a plurality of connection terminals(106). an IC chip is provided on one side of a semiconductor board. The plurality of the connection terminals(106) are provided on the opposite side of the semiconductor board. The plurality of the connection terminals(106), and are arranged on a location except for the corner of the array. The plurality of the connection terminals(106) are connected to form a rectangular grid array. The plurality of the connection terminals(106) are provided on the second side of the semiconductor board. The plurality of the connection terminals(106) are arranged on a location except for the corner of the array. The plurality of the connection terminals(106) are connected to form a rectangular grid array.