发明名称 ROLLED COPPER FOIL FOR FLEXIBLE PRINTED CIRCUIT BOARD AND A METHOD FOR MANUFACTURING THE FOIL
摘要 PURPOSE: A rolled copper foil for flexible printed circuit board and a method for manufacturing the foil are provided to provide the rolled copper foil with good softening characteristics by increasing a softening temperature and by removing a trouble accompanied with the softening. CONSTITUTION: A rolled copper foil for flexible printed circuit board has following characteristics. The Ag contained is in the range of 0.0100 to 0.0400 wt%. O is in the range of 0.0100 to 0.0500 wt%. The sum of more than one of S, As, Sb, Bi, Se, Te, Pb, and Sn is less than 0.0300 wt%. The thickness is in the range of 5 to 50 micrometers. The anti-softening temperature is in the range of 120 to 150 degrees Celsius. The strength of extension is maintained over 300N per millimeter square.
申请公布号 KR20000034897(A) 申请公布日期 2000.06.26
申请号 KR19990031362 申请日期 1999.07.30
申请人 NIPPON MINING&METALS CO., LTD. 发明人 HATANODAKAAKI;GUROSAWAYOSIO
分类号 C22F1/00;B21B3/00;C22C9/00;C22F1/08;H05K1/00;H05K1/09;H05K3/00;(IPC1-7):H05K3/00 主分类号 C22F1/00
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