| 摘要 |
PURPOSE: A method for fabricating a semiconductor wafer wherein grinding striations are eliminated is provided to improve quality of the front surface of the wafer, and the back surface having a quality suitable for the device process. CONSTITUTION: A semiconductor wafer is obtained by removing a mechanical damage layer by etching both surfaces of the wafer, flattening one of the surfaces by a surface-grinding unit, polishing both of the surfaces, and then subjecting a front surface of the wafer to a finishing mirror-polishing when defining the surface subjected to surface-grinding as a back surface of the wafer.
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