| 摘要 |
PURPOSE: A bump fabricating method is provided to be easy to form a bump whose bonding area is wide. CONSTITUTION: In a bump fabricating method, an end portion(14) of a conductive line(16) is bonded at an electrode(12) by a first tool(20). The end portion(14) has a ball shape. As a portion escaping a circumference end portion(15), a center portion(13), to which the conductive line(16) is induced, is pressed by the first tool(20) so as to be plasticity changed. The conductive line(16) is cut so that the end portion(14) remains at the electrode(12). A center portion of the end portion(14) is pressed by a second tool so as to be plasticity changed. |
