THERMOELECTRIC SEMICONDUCTOR MATERIAL, MANUFACTURE PROCESS THEREFOR, AND METHOD OF HOT FORGING THERMOELECTRIC MODULE USING THE SAME

摘要

PURPOSE: A thermoelectric semiconductor material is provided to have sufficient strength and performance and high production yield. CONSTITUTION: The thermoelectric semiconductor material is characterized in that asintered powder material of a thermoelectric semiconductor having a rhombohedral structure (or hexagonal structure) is hot-forged and plastically deformed to direct either the crystals of the sintered powder structure or the quasi crystals constructing the crystals in a crystal orientation having an excellent performance index.