| 摘要 |
PURPOSE: A cooling of heat-generating electronic components, and, more particularly, a circuit board apparatus and an apparatus and a method is provided to spray-cool an electronic component. CONSTITUTION: An apparatus comprises a housing having a cavity, the cavity sized to enclose an electronic component. The housing includes a first layer having a first aperture and a second layer having a second aperture. The second aperture is in communication with the first aperture and in communication with the cavity. The first and second apertures are sized to receive a fluid, atomize the fluid and discharge the atomized fluid into the cavity. |
