| 摘要 |
<p>PROBLEM TO BE SOLVED: To largely improve manufacturing yield of a printed wiring board by improving resolution by satisfactorily following up a transfer layer to uneven shape of a surface to be laminated without increasing a production cost. SOLUTION: The laminated film comprises a photosensitive layer, a first film having 4 to 90g/mm of a 5%-elongation load per unit width at 80 deg.C (hereinafter called as L5 value as a value in the film lengthwise direction) and 50 to 1000% of elongation at break (a value in a lengthwise direction of the film, and the same in the following), and, in addition to the photosensitive layer and the first film, a second film at an opposite side to the first film of the photosensitive layer. The method for manufacturing the printed circuit board comprises the steps of laminating the laminated film on a board so that the photosensitive layer is brought into contact with the board, then exposing, developing it, releasing the second film, laminating it on the board so that the layer is brought into contact with the board, and then exposing and developing it.</p> |
