| 摘要 |
PURPOSE: A semiconductor device and a method for producing thereof are provided to make a semiconductor device with improved size, thickness and thermal radiation. CONSTITUTION: A semiconductor device and a method for producing thereof include a semiconductor chip(1), a supporter, a plurality of terminals, a link, and a sealing resin. The supporter supports the semiconductor chip on one side. The plurality of terminals are spaced with a predetermined distance from the semiconductor chip. The link electrically couples the terminals and the semiconductor circuits in the semiconductor chip. The semiconductor chip, the links, the terminals are sealed and fixed on the supporter and the terminals. The other side of the support and the other side of the terminal are exposed. |
