METHOD FOR FABRICATING WIRE FILM

摘要

PURPOSE: A wire film fabricating method is provided to form a wire film which is capable of be swept away by the lowest pressure in which a pore of the wire film is possible. CONSTITUTION: In a wire film fabricating method, a metal material(3) of a copper or a copper alloy, which consists of crystalline particles by a plating method or a CVD method, is precipitated on a surface of a seed layer which is formed on a barrier layer. A substrate(1) is heated under a high-pressure oxygen atmosphere so as to progress a crystalline particle growth of the crystalline particle in the metal material while suppressing a pore generation, and thus a total surface of the substrate and the interior of the grooves(2A) or the holes(2B) are coated by a metal material film(4), which does not contain pores.