| 摘要 |
PURPOSE: A semiconductor device is provided to realize a low cost and a small size, and to realize a high radiation characteristic. CONSTITUTION: A semiconductor device comprises a semiconductor device(11), a printed circuit board(12A), a heat spreader(13A), a sealing resin(14A) and a soldering ball(14). The printed circuit board(12A) has a wire layer(16), and a soldering ball(15) is disposed at one end of the wire layer(16), and a wire(19) is bonded at the other end of the wire layer(16). At a center of the printed circuit board(12A) is formed an opening part(40). The heat spreader(13A) is contacted in the state that the semiconductor device(11) is thermally contacted with a stage portion(24A). The sealing resin(14A) consists of a first sealing resin part(26A) and a second sealing resin part(27A) between which the heat spreader(13A) is inserted. |
