METHOD FOR FABRICATING THERMISTOR CHIP

摘要

PURPOSE: A thermistor chip fabricating method is provided to reduce a badness rate by dividing and stacking a chip into each element. CONSTITUTION: In a thermistor chip fabricating method, a mother substrate( is obtained by forming division grooves on an upper plane of a ceramic green sheet so as to be intersected to each other. A plurality of strips(13) are formed by dividing the mother substrate along the division grooves, and thus at an upper plane of each strip(13) is formed the division grooves. In order to form an ohmic electrode, a conductive film is formed on an entire surface of each strip(13) so as to fulfill the grooves. Slits are formed on a main surface of each strip(13) in a length direction by removing corresponding parts of the film so as to be distinguished each other. A plurality of strips(13) are stacked and attached with an insulation material(5/6) interposed between an upper strip and a lower strip. The stacked structure is divided along the division grooves to form divided elements.