发明名称 BAKE-HARDENABLE SOLUTION FOR FORMING A CONDUCTIVE COATING
摘要 PURPOSE: A bake-hardenable solution is provided for forming a conductive coating when hardened electrically. CONSTITUTION: The resultant conductive panel coating (38) is utilized for electrically interconnecting a metal stud (27) embedded in a side wall (20) of a face plate panel (12) of a CRT (10) to a conductive layer (24) overlying a luminescent screen (22) on an interior viewing surface of the panel. The solution consists essentially of the following ingredients: glass frit powder; graphite; organic binder; solvent; and a material to enhance the porosity of the resultant conductive panel coating
申请公布号 KR20000036192(A) 申请公布日期 2000.06.26
申请号 KR19997002247 申请日期 1999.03.17
申请人 THOMSON CONSUMER ELECTRONICS, INC. 发明人 BARTCH, DONALD, WALTER;EDWARDS, JAMES, FRANCIS
分类号 H01J9/20;H01J29/20;H01J29/88;(IPC1-7):H01J29/88 主分类号 H01J9/20
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