摘要 |
Engraving process comprises etching an active layer or rendering zones of the layer inactive to leave active islands for making sources (12), channels (10) and drains of N-type and P-type transistors. The active islands are covered by an insulating layer (8) e.g. of silicium oxide, covered in turn by a conducting layer (9) of N+ doped polycrystalline silicium, tungsten, molybdenum or aluminum, etched with the transistor grids. The procedure can employ a substrate (4) or glass, plastic or quartz.
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