| 摘要 |
PROBLEM TO BE SOLVED: To provide s semiconductor device wherein radiation efficiency of the heat generated by circuit operation of a semiconductor element is improved for improved cooling efficiency, thus achieving high capacity. SOLUTION: Semiconductor elements 51-54 are mounted on a first heat- radiation plate 2 through a first high heat-conductivity insulating substrate 41, and a second heat-radiation plate is attached to the semiconductor elements 51-54 through a second high heat-conductivity insulating substrate 71. The heat generated at the semiconductor elements 51-54 is cooled in two directions, upper and lower. A heat sink 1 is provided below the first heat-radiation plate 2. The semiconductor elements 51-54 and the second high heat-conductivity insulating substrate 71 are tightly fitted and press-contacted with a high heat- conductivity adhesive material of a good heat conductor. |
