发明名称 CONVERSION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a conversion module of a simple structure with less number of parts. SOLUTION: On the upper-surface side of a conversion substrate 3 constituting the conversion module 1, an element 9 for voltage conversion, etc., is mounted. In a socket pin insert hole 5 opened at the conversion substrate 3, a socket pin 24 comprising a head part P1 and a leg part P2 is inserted/fitted. The head part P1 provides a structure wherein a terminal at the lower surface of a grid array 2 is attached/detached. The leg part P2 extends above the lower end surface of the head part P1 while smaller in diameter than the head part P1. When the socket pin 24 is inserted for fixing, the tip end of the leg part P2 is protruded above the lower-surface side of the conversion substrate 3 by such length as insertable extratable from a pin insert/extract hole 44. The upper end surface of the head part P1 is exposed above the upper-surface side of the conversion substrate 3.
申请公布号 JP2000174178(A) 申请公布日期 2000.06.23
申请号 JP19980349870 申请日期 1998.12.09
申请人 IBIDEN CO LTD 发明人 NAGAYA KUNIO;HAYASHI HIROAKI
分类号 H05K1/18;H01L23/32;(IPC1-7):H01L23/32 主分类号 H05K1/18
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