| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a pin grid array package capable of being made lower back. SOLUTION: This socket has a plate-like base housing 2, equipped with a plurality of terminals in grid-like formation and a plate-like slide cover 3 equipped with a plurality of through-holes 8 in grid-like formation allowing a lead pin to pass therethrough. A slide means is provided for sliding the slide cover 3 between a position enabling the lead pin to be inserted by zero insertion force into a terminal mounting part in the base housing 2 through a through-hole 8 and a position electrically engaging a terminal with the lead pin inserted in the terminal mounting part. The slide cover 3 is made up by over molding an insulating resin 12a on a metallic plate provided with openings in grid-like formation, and the through-holes 8 are formed through the openings, The base housing 2 is made up by over-molding an insulating resin 12b on a frame member made of metal.
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