| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a non-contact IC card, etc., by omitting the complicated adhesive solution applying process at the time of sticking electronic parts, such as the IC chip, antenna body to a member for surface by using a member for substrate and, in addition, reducing the number of parts. SOLUTION: An electronic parts holding body is provided with electronic parts 4 for card and a hot-melt holding member 10 which holds the parts 4 and the member 10 is formed by forming a heated and softened hot-melt adhesive member to a prescribed thickness and a prescribed size after the adhesive member is applied to the parts 4. When the holding member is constituted in the above way, the parts 4 can be fixed surely by means of the holding member 10 and the member 10 can protect the parts 4 from external impacts under an ordinary-temperature condition. When the holding body is heated, in addition, the holding member 10 can be used as an adhesive, because the member 10 melts. |
