| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-made encapsulating cover, which can be easily removed from an electronic apparatus as one of means for lowering the recycling process cost. SOLUTION: An annular thin wall 1b is made at the bottom peripheral edge of a recess 1a in an encapsulating cover 1. The thickness of the thin wall 1b is smaller than that of a bottom 1c of the recess 1a in the cover and set to be large to an extent such that when an outer periphery of the cover 1 secured by a setscrew 2 is hit in a direction shown by the arrows X, the cover is not cracked when hit by hand but cracked when strongly hit by a hammer or the like. When the thin wall 1b is broken, the bottom 1c can be detached from the cover 1 together with the setscrew 2. For this reason, the need for such an operation as for turning the setscrew 2 with use of a screwdriver, etc., every time can be eliminated and thus the cover 1 can be easily removed from a structure 3. |
