| 摘要 |
PROBLEM TO BE SOLVED: To inspect the thickness and interval of inner lead tip parts in a short time with high precision without being affected by the top surface and reverse surface states of the inner leads, to simplify the constitution of the inspecting device, and to reduce the cost needed for the inspecting device and inspection. SOLUTION: This device 1 optically reads an image of the tip parts of inner leads 12a... constituting the lead array 12 of a TAB frame (mount substrate) having an opening part 11 where a semiconductor element is arranged and the lead array 12 composed of inner leads 12a.... Here, the device is equipped with a light source 2, a beam splitter (reflecting means) 3 which is arranged inside the tips of the lead array 12 in the opening part 11 opposite the lead array 12 and reflects an image obtained by reflecting the light from the light source 2 by the tip parts of the inner leads 12a... of the lead array 12, and a camera (image read means) 4 which captures the image reflected by the beam splitter 3.
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