| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting density of each part by laminating a plurality of printed board where parts such as various electronic parts are mounted to constitute a multi-layer hybrid integrated circuit device. SOLUTION: A plurality of metal spacers 9, 10, and 11 forming intervals among printed boards are provided at a part inside the outer peripheral surface of printed board, among printed boards 1, 2, and 3. The spacer is jointed with a solder to a terminal electrode pattern of both printed boards sandwiching the spacer. |
