| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module wherein a power elements prevented from thermal breakage even if the temperature of a sealed-in power element rises rapidly. SOLUTION: Related to a semiconductor chip 4 where a power element is formed on its surface, a connection line which electrically connects an external electronic part to a power element uses a metal plate 34 so that the temperature of semiconductor chip 4 is efficiently propagated to the metal plate 34. A cap 42 is placed on the metal plate 34 while a low melting-point alloy 44 is packed into the space formed by the cap 42 and the metal plate 34. When the temperature of semiconductor chip 4 rises rapidly to allow the low melting- point alloy 44 to melt, the low melting-point alloy 44 absorbs the heat of melting for constant temperature. Thus, the temperature of semiconductor chip 4 is stabilized at a constant value, preventing breakage of a chip due to rapid temperature rising. |
