| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with no lifting of a resin end part by forming a recess on the upper surface of the resin above a semiconductor chip. SOLUTION: A semiconductor chip 11 is tightly fitted to a substrate 10 of flexible sheet, a wiring layer 14 on the surface of substrate 10 is connected to an electrode pad 18 with a wire 19, and a resin layer 12 is formed on the substrate 10 to seal a semiconductor device 11. At the resin layer 12 above the semiconductor chip 11, the recess 12a which reduces the film thickness of the resin layer 12 is formed. The ends 21 of the recess 12a almost agree with the ends 22 of the semiconductor chip 11.</p> |
