| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein resin-contraction changes no mounting height by diagonally cutting off the upper surface of a resin. SOLUTION: A semiconductor chip 11 is tightly fitted to a substrate 10 of flexible sheet, a wiring layer 14 on the surface of substrate 10 is connected to an electrode pad 18 with a wire 19, and a resin layer 12 is formed on the substrate 10 to seal a semiconductor device 11. The upper surface of resin layer 12 comprises a flat surface 12a and a slope 12b. The ends of flat surface 12a agree with those of semiconductor chip 11 while a highest position 20 of the wire 19 almost agrees as well. The flat surface 12b reduces the amount of resin at the peripheral part of semiconductor chip 11, with the film thickness of the resin layer 12 at the peripheral part reduced in advance.</p> |
