| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with no lifting of a resin end by coating a plate on a semiconductor chip for reduced remaining film thickness. SOLUTION: A semiconductor chip 11 is tightly fitted to a substrate 10 of flexible sheet, a wiring layer 14 on the surface of substrate 10 is connected to an electrode pad 18 with a wire 19, and a resin layer 12 is formed on the substrate 10 to seal a semiconductor device 11. The upper surface of resin layer 12 comprises a flat surface 12a and a slope 12b. On the upper part of semiconductor chip 11, a plate 30 comprising a material whose linear expansion coefficient is similar to a silicon is coated, and a remaining film thickness t3 of the resin layer 12 on the semiconductor chip 11 is reduced.</p> |
