| 摘要 |
PROBLEM TO BE SOLVED: To contrive enhancements in working efficiency in an assembling step and improvements in mass production. SOLUTION: This manufacture forms a separating groove 21 in a scribe region defined in a mutual boundary part of a plurality of semiconductor element forming parts 10a, 10b formed on a surface of a semiconductor substrate 11, a partial region of the scribe region in the semiconductor region 11 is left behind and a split hole is formed in the scribe region, the partial region is defined as a substrate connection part 22, and the substrate connection part 22 is cut off along the separating groove 21, so that the respective semiconductor element forming parts 10a, 10b are separated as chips 10.
|
