| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with a heat sink herein cracking of a package at solder reflow is prevented, coping with different chip size with non degraded heat dissipation of the heat sink as a secondary-effect. SOLUTION: Since a corner part 1a of a semiconductor chip 1 is covered with a resin through a hole 11 formed at a heat sink 2, the start point of crack is reinforced, cracking of a package at solder reflow prevented. The heat generated at the chip 1 is so dissipated through the heat sink 2 and inner and outer leads as to propagate outward from the center of the package. However, the hole 11 formed at the heat sink 2 is formed toward outside from the center of the heat sink 2, so drop of heat dissipation is suppressed to minimum with no heat-flow direction prevented. As a hole is formed in the direction traveling from the center of the chip 1 toward the corner part 1a, the chips 1 of various sizes are coped with. |
