| 摘要 |
PROBLEM TO BE SOLVED: To narrow its breadth and to sufficiently lower its resistivity so as to attain high patterning precision as a cathode electrode and obtain a high aperture ratio by forming a base electrode with photolithography, applying Ni plating thereon. SOLUTION: A glass substrate with a low coefficient of expansion is washed and dried. It is flatly coated with photosensitive electrode paste by screen printing and is dried to provided an Ag electrode paste layer. Succeedingly it is aligned with a glass mask in proxy and exposed. Subsequently, after a pattern is formed by developing, washing with water and drying, an Ag electrode is sintered. Ni is arranged on a cathode part of a plasma cell part with electroplating using a sulfamic acid Ni plating bath. Cover glass paste is coated by screen printing to prevent an abnormal discharge at a terminal of plasma channel. Subsequently ribs which are to form walls of the plasma cell are coated and dried twenty times by screen printing and sintered. The top of ribs is ground with sandpaper and sufficiently washed.
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