| 摘要 |
PROBLEM TO BE SOLVED: To allow excellent thermal conductivity and high adhesive strength to be compatible by incorporating a filler made of a photocuring resin cured by emitting a light and an inorganic open cell foam in an adhesive resin layer. SOLUTION: 50 g of a polymer (a weight-average molecular weight of 700,000, a composition ratio: EA/GMA=8/2 (by weight)) of an ethyl acrylate(EA) and a glycidylmethacrylate(GMA) as a polymer, 150 g of a photocuring resin (epoxy resin) and 1 g of an optical cationic polymerization initiator are stirred and dissolved with 300 g of an ethyl acetate until becoming uniform to form a resin solution. Then, an inorganic open cell foam made of aluminum oxide (its purity of 98%) is impregnated with the solution, and a solvent is evaporated to form a resin-continuous open cell form composite material. This composite material is sliced in a thickness of about 300μm to thermal conductive sheets. Thus, the sheet can be easily adhered to an applying component or an applying part, and excellent adhesive strength can be obtained.
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