发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and method, in which a empty tape is accommodated depending on the type thereof and which does not require classification work after collection. SOLUTION: In an electronic component mounting apparatus for picking up electronic components with a shifting head 13 from a supply part 16 and then moving the components to a substrate 12, a plurality of feeder bases 17 loading a tape feeder 18 for supplying electronic components to a pickup position through pitch feeding of the tape holding the electronic components to the supply part 16 are installed, and each feeder base 17 is provided with a collection box, which is provided with the tape feeder 18 of the same type for discriminating and collecting the empty tape ejected from the tape feeder 17 depending on the type of vacant tape. Thereby, the discriminating work for discriminating the various types of vacant tape after the vacant tape being cut can be dispensed with.
申请公布号 JP2000174492(A) 申请公布日期 2000.06.23
申请号 JP19980346346 申请日期 1998.12.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIDESE WATARU
分类号 H05K13/02 主分类号 H05K13/02
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