| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to decrease the splitting defects in a splitting stage by the arrangement constitution of columnar film spacer patterns arranged in the spacing between an array substrate and a counter substrate. SOLUTION: This spacer forming method consists of continuously forming the columnar film spacer patterns 2-1 in the outer peripheral part on the counter substrate splitting line 2-8 of a seal chip pattern 2-6A so as to form partition walls of exuding of a sealing material to the counter substrate splitting line 2-8 when forming the columnar film spacer patterns between the array substrate and the counter substrate. Then, the exuding portion of the sealing material from the seal chip pattern 2-6A does not cross the splitting line 2-8 of the counter substrate and, therefore, the splitting stress is liable to be applied evenly on the splitting line 2-8 and eventually, the splitting property is improved and the splitting defects in the splitting process may be decreased.
|
