| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation characteristic of a high-radiation package and the cost performance and cope with the power increase of mounted semiconductor devices by using a diamond substrate which mounts the semiconductor devices and a high-thermal-conductivity metal bonded to its opposite side. SOLUTION: A semiconductor device 8 is mounted on one surface of a diamond substrate 1, a metallized layer for bonding the semiconductor device 8 is formed on the one surface, the semiconductors device 8 thereon is fixed with wax, and a high-thermal-conductivity metal 3 is formed on the other surface of the diamond substrate 1 for the purpose of assisting the heat spread effect of diamond, thereby suppressing the diamond consumption as well as keeping and enhancing the heat radiation. Thus, it is possible to improve the cost performance of the entire package and allow the heating quantity of the mounted semiconductor device 8 to augment. |
