POLISHING TOOL OF PLURAL WAFERS

摘要

PROBLEM TO BE SOLVED: To provide a CMP polisher giving a greater throughput than an existing CMP(chemical mechanical polishing) polisher. SOLUTION: This wafer polishing tool comprises: a plurality of polishing platens 14 stacked vertically so as to rotate around a central platen shaft 18; and a plurality of wafer carriers 22 stacked vertically which support a wafer so as to move in a vertical direction so that the wafer is rotatably brought into contact with the polishing platen 14. A wafer carrier pack 12 maintains the wafer so as to bring a wafer surface region smaller than the entire surface of the wafer into uninterrupted contact with the platen.