| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus, capable of precisely setting a searching start position corresponding to bending condition of a print wiring board. SOLUTION: In mounting an electronic component 2 to a first substrate 8, the electronic component 2 chucked to a nozzle 12 is lowered to an initial searching start position Sa preset with a margin at a prescribed (high) speed and then is lowered to the substrate 8 at a search speed lower than the prescribed speed, an abutment position is detected on which the electronic part 2 abuts against the substrate 8, a correction search start position Sb is sought, by correcting the initial searching start position Sa based on the detected abutment position. Next, in mounting the electronic component 2 to a second and following substrate 8, the electronic component 2 chucked to the nozzle 12 is lowered to the correction search start position Sb at a prescribed speed and then is lowered from the correction search start position Sb to the substrate 8 at the search speed.
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