| 摘要 |
PROBLEM TO BE SOLVED: To facilitate replacement of a circuit component when it becomes defective by soldering a metal foil onto an installation area of a circuit component and attaching the metal foil to a housing when installing the circuit board on the housing and, in the case of replacement of the component, applying heat to the soldered section to melt the solder and remove the component from the soldered section. SOLUTION: A ceramic case 5 has a metal face made by plating, etc., on a rear face (a face on the side installed to a housing). A copper foil 13 is attached under heat to the metal face through sheet solder 12. When a circuit component has to be removed from the housing 2 due to a defect, etc., of the component, the defective circuit component can be removed by exiting the solder 12 by hot air, an iron, etc. When a new circuit component with a metal foil 13 is installed on the housing 2, it is attached on the metal foil 13 left behind on the housing 2.
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