发明名称 PRINTED WIRING BOARD AND ITS ELECTRICAL INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board and its electrical inspection method, capable of sensing electric faults in which the clearance between its conductors is a very narrow state about to short-circuit. SOLUTION: A printed wiring board has a via hole formed in its effective circuit portion and for electrically connecting an interlayer, an adjacent conductor pattern to the via hole, another via hole 2a formed in a portion other than the effective circuit portion, and a surface-layer pattern 4a formed adjacent to the via hole 2a. In this printed wiring board, a clearance A between the via hole 2a and the surface-layer pattern 4a is made smaller than the that between the via hole formed in the effective circuit portion and the adjacent conductor pattern thereto. Thereby, an electric fault can be sensed in the effective circuit portion in which its conductors are about to short-circuit.
申请公布号 JP2000174401(A) 申请公布日期 2000.06.23
申请号 JP19980347587 申请日期 1998.12.07
申请人 SONY CORP 发明人 NAKANO TAKUO;GOTO MAYUMI;UENO RYOICHI;IMAI YOSHIHIKO
分类号 H05K1/11;H05K3/00;(IPC1-7):H05K1/11 主分类号 H05K1/11
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