发明名称 PLASMA TREATING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the generation of foreign matters in a treating chamber by eliminating a deposition of reaction products, which are generated on the inner wall of the treating chamber by etching, by a method wherein the low-temperature part of a plasma generating part in a container is warmed by an electromagnetic wave absorber. SOLUTION: Deposition amount of reaction products which are generated on the inner wall of a treating chamber at the time of an etching treatment is great in the vicinity of the outermost peripheral part of a shower plate 3, which is also a high-frequency transmitting window, and these reaction products are separated from the outermost peripheral part to turn into a foreign matter source, which is generated in the chamber. In this case as the main cause due to the deposition amount of the reaction products, a fact is mentioned that the temperature of the plate 3 is low. There, for raising the temperature of the outer peripheral part of the plate 3, a ring 13 formed by forming an SiC, for example, into a ring shape using a microwave absorber, is provided to bring it into contact with the plate 3, and the outer peripheral part of the plate 3 is heated by this ring 13. Thereby, the reaction products does not deposit on the inner wall of the chamber, the generation of foreign matters in the chamber can be prevented.
申请公布号 JP2000173983(A) 申请公布日期 2000.06.23
申请号 JP19980341364 申请日期 1998.12.01
申请人 HITACHI LTD 发明人 YAMASU HIROAKI;FUJII TAKASHI;MATANO KATSUJI;KIHARA HIDEKI;SUMIYA MASANORI;KANEKIYO TAKAMITSU
分类号 H01L21/302;C23C16/50;C23C16/511;C23F4/00;H01L21/3065;H01L21/31;H05H1/46 主分类号 H01L21/302
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