| 摘要 |
PROBLEM TO BE SOLVED: To supply a wafer surface in a wetting state by a method wherein a plurality of sheets of wafer are vertically laminated and housed having mutually parallel spaces in a substantially horizontal state within a wafer housing cassette, respectively, and the wafer fetch-out position is set at a position where the wafers at a lower stage are in a dipping state in dipping water within a water bath. SOLUTION: At a fetch-out position of wafers 10 which have previously been determined upward of a water bath 1, the wafers 10 within a cassette 11 elevated and positioned by a stage mechanism 2 are extracted from the cassette 11, and there is comprised a handling robot for carrying them to a predetermined position for a next step, and a plurality of the wafers 10 are vertically laminated and housed having mutual parallel spaces in a substantially horizontal state within the cassette 11, respectively. At the fetch-out position of the wafers 10 positioned by the stage mechanism 2, the wafers 10 at a lower stage than those to be extracted are set at a position where they are in a dipping state in dipping water within the water bath 1. |
