| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which can make an optical pickup device thin without arranging and installing the semiconductor laser device obliquely. SOLUTION: This semiconductor laser device 11 is constituted in such a way that at least a semiconductor laser 1 and a photodetector 4 are arranged inside a package. The semiconductor laser device is constituted in such a way that a laser beam which is radiated from the semiconductor laser 1 is radiated at an arbitrary angle other than the verticality from the package. When an optical pickup device is constituted by using the semiconductor laser device 11, the optical pickup device can be miniaturized and made thin. |
