| 摘要 |
PROBLEM TO BE SOLVED: To prevent a breakage of an element caused by an impact without direct transmission of an external impact to a heat sink to the element, by a buffering operation of a biasing means by bringing the sink into contact with the element through the biasing means and a heat transfer pin. SOLUTION: The heat sink 10 comprises a heat transfer pin 18 provided projectably from or retractably in a chip 12 on an opposed surface 14a to the chip 12, and further the biasing spring 20 provided in a protruding direction of the pin 18. Here, the biasing spring 20 is compressed while urging the pin 18 to the chip 12, and a heat sink body 14 is fixed to a circuit board 11 by a spacer 32. When the chip 12 is energized and heated in this state, a heat is radiated from the pin 18 through a pin socket 22, the body 14 and radiating fins 16. An external impact to the sink 10 is given to the board 11 through the spacer 32, but the pin 18 brought into contact with the chip 12 is biased by a spring force, the impact is absorbed by the biasing spring 20 to prevent a damage of the chip 12.
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