| 摘要 |
PROBLEM TO BE SOLVED: To improve the forming quality of a molding by uniformly and quickly charging a seal resin by printing among metal pillars and avoid depositing the seal resin to the end faces of the metal pillars to which external connection terminals are bonded. SOLUTION: Metal posts 2 are erected on a wiring layer formed on a wafer 1, a seal resin 3 is coated by printing to fill spaces among metal posts 2, a work to be molded which is coated with the seal resin 3 is set in a mold die 4 having a parting face overlaid with a release film 10 and an upper and lower dies 6, 8 are clamped through the release film 10, and the seal resin 3 is heated to harden, thus forming a molding.
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