| 摘要 |
PROBLEM TO BE SOLVED: To electrically and mechanically connect a circuit board and other conductive patterns stably and easily with high reliability to increase the assembly work efficiency by electrically connecting the circuit board and other conductive patterns using the elasticity of the material of the circuit board made by injection molding of plastic. SOLUTION: A three-dimensional substrate 1 is made by injection molding of plastic and is formed with a connection section 2, positioning and pressing sections 3, and spheric projections 5 as integral parts of it. At necessary places on an upper face of the substrate, desired conductive patterns are formed of a thin film layer made of copper, etc. The spheric projections 5 and extraction patterns 6 are formed with conductive patterns and the connection section 2 is formed with a plurality of cutouts 4 for obtaining the elasticity. The connection section 2 is formed into a plurality of independent tongue-like parts by the cutouts 4. Walls 7-9 of the positioning and pressing sections 3 are formed on both ends of the connection section 2 to determine the layout of other conductive patterns to be connected to the substrate 1. The pattern layout in the (y) direction is made at a distance between the wall 8 and the spheric projections 5 and the conductive patterns are connected to the substrate 1 under contact pressure.
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