| 摘要 |
PROBLEM TO BE SOLVED: To completely fill the inside of micro wiring grooves, via holes, contact holes, and the like with a dispersion liquid by a method wherein one part of the dispersion liquid is removed or moved with a brush in the midst of formation of a film with a spin coater with the dispersion liquid dripped on a substrate. SOLUTION: When a liquid film is to be formed by a spin coating method, a dispersion liquid 2 coated on a substrate 1 functions as a cover, and the liquid film part directly over grooves, holes 3 and the like is removed or moved by a hair brush or gas brush, whereby the air confined in the grooves, holes and the like is made to exhaust to the outside. By this constitution, the fluid 2 can again flow into the groove and holes, and the filling characteristic of the liquid can be raised. For making the effect of the brush act satisfactorily, the brush, which removes the liquid film in direct contact with the substrate 1 rotated by a motor, or makes movable the liquid film, may also be mounted to a spin coater.
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